Printed Circuit Board Capabilities

Feature Capabilities

• Layer Count: Single- 16 Layers
• Minimum Conductor Width: .005″
• Minimum Conductor Space: .005″
• Minimum Hole Size: .0079″
• Minimum Material Thickness: .005″- .200″
• Copper Thickness Outer: up to 10 oz.
• Copper Thickness Inner: up to 4 oz.

Materials

• FR-4 & High Temp FR-4
• Polyimide
• Kapton
• Microwave (Teflon) Laminates
• Rogers Duroid & Similar Laminates
• Thermagon, Berquist, Arlon, and Ventec

Product Final Finishes

• SMOBC/ HASL- Standard & Lead Free
• Electroplated Nickel/Gold
• Immersion Nickel/ Gold
• Immersion & Plated Tin
• Immersion Silver
• OSP
• Soft Wire Bondable

Quality Assurance

• Inner & Outer Layer AOI Capability
• Drilling X-Ray Registration
• 100% Net-List Fixture
• NetList Testing- Flying Probe and Dedicated Fixture
• Microsection/ Thermal Stress Testing
• T.D.R. Testing
• Ionic Contamination Testing
• Coordinate Measurement Capability
• Production Part Approval Process (PPAP)
• Gage R&R

Equipment List

• Laser Defined Imaging
• 26 drills, combination of Excelon and Dynomotion
• 19 Routers, combination of Excelon and Dynomotion
• 10 printers for imaging
• DES and SES manufactured IS
• Separate Imaging and Soldermask Developers
• 3 Hyoki Scrubbers
• 15 pumis scrubbing and deborring equipment
• 2 Sempco lead free HASL
• 2 Sempco standard HASL
• 7 ET Machines
• Flying Probe Test
• 3 automated OEM
• 6 opening presses
• 2 wabash presses

Software & CAM

• CAD-CAM 350
• Genesis Software