PCB Capabilities

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Feature Capabilites

  • Layer Count: Single- 16 Layers
  • Minimum Conductor Width: .005″
  • Minimum Conductor Space: .005″
  • Minimum Hole Size: .0079″
  • Minimum Material Thickness: .005″- .200″
  • Copper Thickness Outer: up to 10 oz.
  • Copper Thickness Inner: up to 4 oz.

 

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Materials

  • FR-4 & High Temp FR-4
  • Polyimide
  • Kapton
  • Microwave (Teflon) Laminates
  • Rogers Duroid & Similar Laminates
  • Thermagon, Berquist, Arlon, and Ventec

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Product Final Finishes

  • SMOBC/ HASL- Standard & Lead Free
  • Electroplated Nickel/Gold
  • Immersion Nickel/ Gold
  • Immersion & Plated Tin
  • Immersion Silver
  • OSP
  • Soft Wire Bondable

 


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Quality Assurance

  • Inner & Outer Layer AOI Capability
  • Drilling X-Ray Registration
  • 100% Net-List Fixture
  • NetList Testing- Flying Probe and Dedicated Fixture
  • Microsection/ Thermal Stress Testing
  • T.D.R. Testing
  • Ionic Contamination Testing
  • Coordinate Measurement Capability
  • Production Part Approval Process (PPAP)
  • Guagae R&R


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Equipment List

  • Laser Defined Imaging
  • 26 drills, combination of Excelon and Dynomotion
  • 19 Routers, combination of Excelon and Dynomotion
  • 10 printers for imaging
  • DES and SES manufactured IS
  • Separate Imaging and Soldermask Developers
  • 3 Hyoki Scrubbers
  • 15 pumis scrubbing and deborring equipment
  • 2 Sempco lead free HASL
  • 2 Sempco standard HASL
  • 7 ET Machines
  • Flying Probe Test
  • 3 automated OEM
  • 6 opening presses
  • 2 wabash presses


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Software & CAM

  • CAD-CAM 350
  • Genesis Software